Please use this identifier to cite or link to this item:
http://hdl.handle.net/123456789/327| Title: | The preliminary study of the addition zinc in tin-copper lead free solder | Authors: | Wong, W.Y. Shamsudin, R.A. Mohd Nazeri, M.F. Masri M.N. |
Keywords: | Corrosion;Lead free solder;Tin-copper;Zinc | Issue Date: | 2020 | Publisher: | Trans Tech Publications Ltd | Journal: | Materials Science Forum | Conference: | 3rd International Conference on Advanced Materials Characterization Techniques, AMCT 2019 | Abstract: | Sn-0.7Cu lead free solder has become an alternative material to replace Sn-Pb solder. However, it has the weakness of high melting point and poor corrosion behavior. Through the study, Sn-0.7-xZn microstructure and phase changes were studied through scanning electron microscope (SEM) and X-ray diffraction (XRD). SEM result shows microstructure Cu6Sn5 is precipitated with rod like shape while CuZn is shown in bump oval shape whereas compounds that presented are Cu6Sn5 and Cu5Zn8 as shown in the XRD analysis result. © 2020 Trans Tech Publications Ltd, Switzerland. |
Description: | Scopus |
URI: | http://hdl.handle.net/123456789/327 | ISBN: | 978-303571582-8 | ISSN: | 02555476 | DOI: | 10.4028/www.scientific.net/MSF.1010.104 |
| Appears in Collections: | Faculty of Bioengineering and Technology - Proceedings |
Show full item record
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.