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Title: | Bending properties of particleboard from Hibiscus cannabinus (Kenaf), Leucaena sp. (Petai belalang), and Hevea brasiliensis (Rubberwood) | Authors: | Khalid M.H. Ahmad N. Nor M.Z.B.M. Tamat, N. S. M. Mansor R. Wan W.M.N.B. Rahman A. |
Keywords: | Elastic modulus;Materials;Biomaterials | Issue Date: | 1-Aug-2024 | Publisher: | American Institute of Physics | Conference: | AIP Conference Proceedings | Abstract: | This study presents the manufacturing of particleboard produced from a mixture of sustainable biomaterials. The evaluations are conducted to determine the bending properties of particleboard from the mixture of Kenaf core, Leucaena, and Rubberwood and the effect of different biomaterial ratios on particleboard properties. The usage of urea-formaldehyde (UF) as a particleboard binder and a target board density of 700 kg/m3 were studied. Particleboards were assessed for the properties of bending according to BS. EN310:1993. Samples were tested by using a universal testing machine (Instron) to get the bending result; modulus of rupture (MOR) and modulus of elasticity (MOE). Treatment of 5% kenaf core shows the highest strength and followed by the treatment of 10% and 15%. All three ratios for MOR meet the minimum standard requirement for BS EN Standard. For MOE, the treatment of 15% does not meet the minimum requirement of the standard. The results revealed that increasing the ratio of the Kenaf core decreased bending strength. However, the analysis of variance (ANOVA) shows no significant difference between those treatments. All the treatments in this study have the potential to be used in particleboard manufacturing except for the treatment of a 15% ratio of kenaf core. To increase their bending properties, it would be important to consider possible other combinations of biomaterials as raw material. © 2024 AIP Publishing LLC. |
Description: | Scopus |
URI: | http://hdl.handle.net/123456789/6407 | ISSN: | 0094243X | DOI: | 10.1063/5.0202483 |
Appears in Collections: | Faculty of Bioengineering and Technology - Proceedings |
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