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Title: | Studies on particleboard production using Expanded Polystyrene (EPS) waste as a binder for construction applications | Authors: | Rofdi M.I. Tamat, N. S. M. Nuryawan A. Sakagami H. Hermawan, A. |
Keywords: | Mechanical properties;Particleboard;Physical properties | Issue Date: | Oct-2024 | Publisher: | Elsevier Ltd. | Journal: | Construction and Building Materials | Abstract: | This study explored the potential of using EPS waste as a substitute for synthetic resin in particleboard production. The objectives were to assess the impact of various processing parameters, including board density, EPS waste percentage, and pressing temperature, on the properties of the board. For this purpose, lab-scale particleboards were fabricated by combining kelempayan wood particles with EPS waste powders. Subsequently, the physical, mechanical, and thermal stability properties of the board were assessed. The results indicated that the board density, EPS waste percentage, and pressing temperature influenced the physical, mechanical, and thermal stability properties of the board. The bending properties, internal bond (IB) strength, and thickness swelling (TS) of the board exhibited an upward trend with increasing board density. At the same time, the TS decreased while bending properties and IB strength increased with rising EPS waste percentages and pressing temperatures. Notably, the board fabricated with a target density of 0.70 g/cm3, comprising 20 % EPS waste and pressed at 180°C, met the standard requirements for particleboard designated for construction purposes, except the modulus of rupture (MOR), which is slightly lower than the standard requirement. In addition, the thermal stability of the board increased with higher pressing temperatures. Conversely, increasing the density and EPS waste percentage to 40 % appeared to decrease the thermal stability of the board. These findings underscore the significant potential of EPS waste as a binder in particleboard production. |
Description: | Web of Science / Scopus |
URI: | http://hdl.handle.net/123456789/6531 | ISSN: | 09500618 | DOI: | 10.1016/j.conbuildmat.2024.138279 |
Appears in Collections: | Faculty of Bioengineering and Technology - Journal (Scopus/WOS) |
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